Litcius/Paper detail

Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication

Oguzhan Orkut Okudur, Mario González, G. Van den bosch, M. Rosmeulen

2023Microelectronics Reliability10 citationsDOI

Topics & Concepts

WaferFabricationNAND gateMaterials scienceStack (abstract data type)IsotropyScalingLayer (electronics)Finite element methodScalabilityWafer-scale integrationElectronic engineeringOptoelectronicsComputer scienceEngineeringStructural engineeringComposite materialLogic gatePhysicsOpticsGeometryMathematicsMedicinePathologyProgramming languageDatabaseAlternative medicine3D IC and TSV technologiesAdvanced Surface Polishing TechniquesAdvanced ceramic materials synthesis