Integrated Photonics Packaging: Challenges and Opportunities
Luigi Ranno, Parnika Gupta, Kamil Gradkowski, Robert Bernson, Drew Weninger, Samuel Serna, Anu Agarwal, Lionel C. Kimerling, Juejun Hu, Peter O’Brien
Abstract
Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the “packaging bottleneck”.
Topics & Concepts
BottleneckPhotonicsScalabilitySoftware deploymentComputer scienceThroughputPackaging engineeringIntegrated circuitPerspective (graphical)Photonic integrated circuitNanotechnologySystems engineeringMaterials scienceTelecommunicationsEngineeringEmbedded systemOptoelectronicsSoftware engineeringWirelessMechanical engineeringArtificial intelligenceDatabasePhotonic and Optical DevicesNeural Networks and Reservoir ComputingOptical Network Technologies