Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal
Liyuan Wang, Yufei Gao, Xinying Li, Tianzhao Pu, Youkang Yin
Topics & Concepts
Materials scienceWaferDiamondSiliconComposite materialGroove (engineering)Wafer dicingWire speedBendingOptoelectronicsMetallurgyMechanical engineeringEngineeringAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research