Characterization and theoretical calculations of the T(<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si1.svg"><mml:msub><mml:mi mathvariant="bold">Al</mml:mi><mml:mn mathvariant="bold">20</mml:mn></mml:msub><mml:msub><mml:mi mathvariant="bold">Cu</mml:mi><mml:mn mathvariant="bold">2</mml:mn></mml:msub><mml:msub><mml:mi mathvariant="bold">Mn</mml:mi><mml:mn mathvariant="bold">3</mml:mn></mml:msub></mml:math>)/Al interface in 2024 alloys: TEM and DFT studies
Xianzhuo Li, Xia Chen, Yifei Feng, Bin Chen, Bin Chen
Topics & Concepts
Scanning transmission electron microscopyInterface (matter)Materials sciencePhase (matter)Covalent bondAlloyCrystallographyTransmission electron microscopyPhysicsChemistryNanotechnologyQuantum mechanicsMetallurgyComposite materialCapillary numberCapillary actionAluminum Alloys Composites PropertiesAluminum Alloy Microstructure PropertiesMicrostructure and mechanical properties