Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding
Qiushi Kang, Ge Li, Zhengda Li, Yanhong Tian, Chenxi Wang
Topics & Concepts
Materials scienceDangling bondOxideChemical engineeringNanotechnologySurface modificationHybrid materialAmmoniaOptoelectronicsMetallurgySiliconOrganic chemistryEngineeringChemistry3D IC and TSV technologiesFerroelectric and Negative Capacitance DevicesSemiconductor materials and devices