Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints

Shiliang Gong, Gaoqiang Chen, Songtao Qu, Vichea Duk, Xun Xu, Qingyu Shi, Gong Zhang

2024Journal of Materials Science Materials in Electronics10 citationsDOI

Topics & Concepts

SolderingMaterials scienceMicrostructureJoint (building)Shear (geology)Shear strength (soil)BrittlenessComposite materialDirect shear testFracture (geology)MetallurgyIntermetallicStructural engineeringAlloySoil waterSoil scienceEnvironmental scienceEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis