Multifunctional Thermally Conductive Composite Films Based on Fungal Tree‐like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers
Yixin Han, Kunpeng Ruan, Junwei Gu
Abstract
Abstract Thermal conduction for electronic equipment has grown in importance in light of the burgeoning of 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics and extensive mechanical properties. In this work, “solvothermal & in situ growth” method is carried out to prepare “Fungal tree”‐like hetero‐structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) thermally conductive fillers. The thermally conductive AgNWs@BNNS/ANF composite films are obtained by the method of “suction filtration self‐assembly and hot‐pressing”. When the mass fraction of AgNWs@BNNS is 50 wt%, AgNWs@BNNS/ANF composite film presents the optimal thermal conductivity coefficient of 9.44 W/(m ⋅ K) and excellent tensile strength of 136.6 MPa, good temperature‐voltage response characteristics, superior electrical stability and reliability, which promise a wide application potential in 5G electronic devices.