A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
Anil Kunwar, Lili An, Jiahui Liu, Shengyan Shang, Peter Råback, Haitao Ma, Xueguan Song
Topics & Concepts
SolderingIntermetallicMaterials scienceScanning electron microscopeLaser power scalingFinite element methodLaserAlloyComposite materialMorphology (biology)OpticsStructural engineeringEngineeringGeneticsBiologyPhysicsElectronic Packaging and Soldering TechnologiesAdditive Manufacturing Materials and ProcessesWelding Techniques and Residual Stresses