Mechanically enhanced healable and recyclable silicone with dynamic hindered urea bond for flexible electronics
Wenjie Sun, Lei Zhang, Shuang Wang, Jiale Mao, Jiaming Luo, Yu Chen, Yonghong Cheng
Abstract
A silicone-containing dynamic hindered urea bond for flexible electronic substrates is developed with enhanced mechanical strength and healing ability simultaneously.
Topics & Concepts
Materials scienceSiliconeElectronicsUreaBond strengthComposite materialFlexible electronicsNanotechnologyOrganic chemistryAdhesiveElectrical engineeringEngineeringChemistryLayer (electronics)Advanced Sensor and Energy Harvesting MaterialsPolymer composites and self-healingElectrospun Nanofibers in Biomedical Applications