Rational design of POSS containing low dielectric resin for SLA printing electronic circuit plate composites
Z.Q. Hu, Yuming Wang, Xueqing Liu, Quan Wang, Xin Cui, Shuxiang Jin, Bin Yang, Yumin Xia, Shuohan Huang, Zhe Qiang, Kun Fu, Jianming Zhang, Yuwei Chen
Topics & Concepts
Materials scienceComposite materialDielectricSilsesquioxaneStereolithographyComposite numberEpoxyDifferential scanning calorimetryCuring (chemistry)Glass transitionThermal stabilityThermosetting polymerPolymerChemical engineeringEngineeringThermodynamicsOptoelectronicsPhysicsSilicone and Siloxane ChemistrySynthesis and properties of polymersDielectric materials and actuators