Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application
Yao Gong, Kyoung Je, Jang Min Park
Topics & Concepts
ThermoformingMolding (decorative)ElectronicsDeformation (meteorology)MoldMechanical engineeringFlexible electronicsMaterials sciencePrinted circuit boardElectrical resistance and conductancePrinted electronicsComposite materialEngineering drawingEngineeringElectrical engineeringOptoelectronicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdditive Manufacturing and 3D Printing Technologies