Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
Bernhard Czerny, G. Khatibi
Topics & Concepts
Power electronicsElectronicsWire bondingElectrical engineeringEngineeringPower (physics)BondMaterials scienceEngineering physicsMechanical engineeringVoltagePhysicsChipQuantum mechanicsFinanceEconomicsIntegrated Circuits and Semiconductor Failure AnalysisNon-Destructive Testing TechniquesMechanical stress and fatigue analysis