One-component epoxy resin adhesive featured with high storage stability based on microencapsulation

Kaihong Zhang, Zijun Wang, Yan Luo

2023Colloids and Surfaces A Physicochemical and Engineering Aspects12 citationsDOI

Topics & Concepts

AdhesiveEpoxyMaterials scienceCuring (chemistry)Thermosetting polymerComposite materialCoatingThermoplasticComposite numberLayer (electronics)Epoxy Resin Curing ProcessesSynthesis and properties of polymersPhotopolymerization techniques and applications