Analysis of a composite piezoelectric semiconductor cylindrical shell under the thermal loading
Zhen Yang, Liang Sun, Chunli Zhang, Chunli Zhang, Chuanzeng Zhang, Chuanzeng Zhang, Cun‐Fa Gao
Topics & Concepts
Materials sciencePiezoelectricitySemiconductorThermalDielectricComposite numberBoundary value problemShell (structure)Composite materialCoupling (piping)OptoelectronicsMeteorologyPhysicsMathematical analysisMathematicsAeroelasticity and Vibration ControlAcoustic Wave Phenomena ResearchComposite Structure Analysis and Optimization