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Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires

Pengxiao Sun, Pengcheng Zhang, J.P. Hou, Q. Wang, Z.F. Zhang

2021Journal of Alloys and Compounds59 citationsDOI

Topics & Concepts

Electrical resistivity and conductivityMaterials scienceGrain boundaryMicrostructureTexture (cosmology)ConductivityDislocationMetallurgyComposite materialStrength reductionOxygenGrain sizeElectrical engineeringChemistryStructural engineeringImage (mathematics)Organic chemistryPhysical chemistryArtificial intelligenceFinite element methodComputer scienceEngineeringMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesFusion materials and technologies
Quantitative mechanisms behind the synchronous increase of strength and electrical conductivity of cold-drawing oxygen-free Cu wires | Litcius