Transient Liquid Phase Bonding Process Using Sn-coated Cu Dendritic Particles
Jun Ho Hwang, Jong‐Hyun Lee
Topics & Concepts
Materials scienceCoatingLiquid phasePhase (matter)Composite materialChemical engineeringMetallurgyThermodynamicsEngineeringChemistryOrganic chemistryPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis