Cu6Sn5 intermetallic: Reconciling composition and crystal structure
Andreas Leineweber, Christian Wieser, W. Hügel
Topics & Concepts
IntermetallicMaterials scienceSolderingComposition (language)Phase (matter)CrystallographyCrystal structureMetallurgyChemistryAlloyOrganic chemistryLinguisticsPhilosophyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesSemiconductor materials and interfaces