Effect of interfacial microstructure evolution on the peeling strength and fracture of silicon nitride/oxygen-free copper foil joints brazed with Ag-Cu-TiH2 filler
Liangliang Tang, Dongxu Yao, Yongfeng Xia, Hanqin Liang, Yu‐Ping Zeng
Topics & Concepts
BrazingMaterials scienceMicrostructureCeramicFOIL methodSilicon nitrideComposite materialCopperNitrideAlloyMetallurgyLayer (electronics)Advanced ceramic materials synthesisAdvanced materials and compositesMXene and MAX Phase Materials