Mechanical properties and microstructure of large-area diamond/silicon bonds formed by pressure-assisted silver sintering for thermal management
Kechen Zhao, Jiwen Zhao, Xiaoyun Wei, Xu Zhang, Chaojun Deng, Yong Yang, Wenxin Cao, Jiecai Han, Bing Dai, Jiaqi Zhu
Topics & Concepts
Materials scienceSinteringDiamondThermal conductivityMicrostructureComposite materialMelting pointSiliconShear strength (soil)MetallurgySoil scienceEnvironmental scienceSoil waterDiamond and Carbon-based Materials ResearchAdhesion, Friction, and Surface InteractionsAdvanced materials and composites