Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging
Limin Ma, Ziyi Lu, Qiang Jia, Zhe Cui, Yishu Wang, Dan Li, Hongqiang Zhang, Guisheng Zou, Fu Guo
Topics & Concepts
SinteringElectronic packagingNanoparticleMaterials scienceElectronicsSolid-state physicsMechanism (biology)NanotechnologyComposite materialChemistryPhysicsPhysical chemistryCondensed matter physicsQuantum mechanicsElectronic Packaging and Soldering TechnologiesNanomaterials and Printing Technologies3D IC and TSV technologies