The mechanical effect of soft pad on copper chemical mechanical polishing
Pengzhan Liu, Yuna Nam, Seunghwan Lee, Eungchul Kim, Sanghuck Jeon, Ki‐Hong Park, Seokjun Hong, Taesung Kim
Topics & Concepts
Chemical-mechanical planarizationPolishingMaterials scienceConsumablesWaferAbrasiveCopperComposite materialAsperity (geotechnical engineering)MetallurgyNanotechnologyBusinessMarketingAdvanced Surface Polishing TechniquesMetal and Thin Film MechanicsAdhesion, Friction, and Surface Interactions