Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging
Qiang Jia, Guisheng Zou, Hongqiang Zhang, Zhongyang Deng, Wengan Wang, Lei Liu, Limin Ma, Fu Guo
Topics & Concepts
Materials scienceMicrostructureSupersaturationSinteringElectrochemistryComposite materialChemical engineeringMetallurgyNanotechnologyElectrodeChemistryOrganic chemistryPhysical chemistryEngineeringElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies