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Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys

Qichao Hao, Xin Fu Tan, Stuart D. McDonald, Keith Sweatman, Tetsuya Akaiwa, Kazuhiro Nogita

2023Journal of Electronic Materials17 citationsDOI

Topics & Concepts

SolderingMaterials scienceBall grid arraySolderabilityMetallurgyAlloyShear strength (soil)Direct shear testComposite materialShear (geology)Soil waterEnvironmental scienceSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
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