Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests
Yunfan Zhang, Kangkang Wu, Hui Li, Shengnan Shen, Wan Cao, Feng Li, Jinzhe Han
Topics & Concepts
SolderingTemperature cyclingMaterials scienceMicroelectromechanical systemsComposite materialWire bondingWedge (geometry)Pressure sensorStress (linguistics)Residual stressJoint (building)ThermalStructural engineeringChipMechanical engineeringOptoelectronicsElectrical engineeringMeteorologyLinguisticsPhysicsOpticsEngineeringPhilosophyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrostatic Discharge in Electronics