Optimization of Cu protrusion of wafer-to-wafer hybrid bonding for HBM packages application

Shizhao Wang, Hehui Zhang, Zhiqiang Tian, Tianjian Liu, Yameng Sun, Yuexin Zhang, Dong Fang, Sheng Liu

2022Materials Science in Semiconductor Processing42 citationsDOI

Topics & Concepts

WaferMaterials scienceWafer bondingOptoelectronicsComposite material3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced Surface Polishing Techniques