Material removal rate model in chemical-mechanical polishing using micro-structured pads
Seounghee Yun, Hyun Jun Ryu, Sanha Kim
Topics & Concepts
PolishingMaterials scienceChemical-mechanical planarizationComposite materialEngineering drawingMechanical engineeringMetallurgyStructural engineeringEngineeringAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationIntegrated Circuits and Semiconductor Failure Analysis