The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire
Tengyun Liu, Peiqi Ge, Wenbo Bi, Yufei Gao
Topics & Concepts
Materials scienceWaferComposite materialGroove (engineering)Fracture (geology)BendingSiliconFracture mechanicsDiamondWeibull distributionMetallurgyNanotechnologyStatisticsMathematicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications