Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging
Zhongyang Deng, Guisheng Zou, Hongqiang Zhang, Qiang Jia, Wengan Wang, Ying Wu, A Zhanwen, Bin Feng, Lei Liu
Topics & Concepts
Materials scienceShear strength (soil)Composite materialMicrostructureNano-NanoparticleBonding strengthBond strengthLayer (electronics)Diffusion bondingNanometreNanotechnologyAdhesiveSoil scienceSoil waterEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies