Fracture Analysis of Planar Cracks in 3D Thermal Piezoelectric Semiconductors
Yuan Li, Shujie Yan, MingHao Zhao, Jingli Ren
Topics & Concepts
Electric displacement fieldMaterials scienceCrack tip opening displacementMechanicsStress intensity factorDisplacement (psychology)IsotropyPiezoelectricityClassification of discontinuitiesCylinderMathematical analysisFracture mechanicsGeometryMathematicsPhysicsComposite materialOpticsPsychotherapistPsychologyNumerical methods in engineeringUltrasonics and Acoustic Wave PropagationMechanical Behavior of Composites