Litcius/Paper detail

Mo-interlayer-mediated thermal conductance at Cu/diamond interface measured by time-domain thermoreflectance

Guo Chang, Fangyuan Sun, Lühua Wang, Yin Zhang, Xitao Wang, Jinguo Wang, Moon J. Kim, Hailong Zhang

2020Composites Part A Applied Science and Manufacturing41 citationsDOI

Topics & Concepts

Materials scienceDiamondThermal conductivityLayer (electronics)Composite materialAnnealing (glass)ThermalSputter depositionThermal conductionMaterial properties of diamondConductanceSputteringThin filmNanotechnologyCondensed matter physicsThermodynamicsPhysicsThermal properties of materialsAdhesion, Friction, and Surface InteractionsDiamond and Carbon-based Materials Research