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Introducing abrasive wear into undeformed chip thickness modeling with improved grain kinematics in belt grinding

Heng Li, Lai Zou, Wenxi Wang, Haonan Li

2023Journal of Manufacturing Processes22 citationsDOI

Topics & Concepts

Materials scienceAbrasiveGrindingChipChip formationSurface roughnessComposite materialSpiral (railway)KinematicsSurface finishGrain sizeTool wearMetallurgyMechanical engineeringMachiningComputer scienceClassical mechanicsPhysicsTelecommunicationsEngineeringAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques
Introducing abrasive wear into undeformed chip thickness modeling with improved grain kinematics in belt grinding | Litcius