Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder
Fengxian Xu, Wenjia Zhu, Jikang Yan, Lingyan Zhao, Jinmei Lv
Topics & Concepts
Materials scienceNucleationDifferential scanning calorimetryPhase (matter)Melting pointAnalytical Chemistry (journal)IntermetallicAlloyPrecipitationCrystallographyMetallurgyComposite materialThermodynamicsChemistryChromatographyPhysicsMeteorologyOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties