Three-dimensional network of hexagonal boron nitride filled with polydimethylsiloxane with high thermal conductivity and good insulating properties for thermal management applications
Li Liu, Ying Li, Xianglei Yu, Jinghong Du, Jiamin Zhang, Junpeng Li, Guoyou Gan
Topics & Concepts
Materials scienceComposite materialThermal conductivityPolydimethylsiloxaneBoron nitrideElectrical conductorComposite numberThermal resistanceElectrical resistivity and conductivityThermalElectrical engineeringPhysicsEngineeringMeteorologyThermal properties of materialsThermal Radiation and Cooling TechnologiesGraphene research and applications