Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field
A.E. Hammad, M. Ragab
Topics & Concepts
MicrostructureMaterials scienceSolderingAlloyUltimate tensile strengthMetallurgyCreepComposite materialElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis