Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration
Marion Branch Kelly, Aravindha R. Antoniswamy, Ravi Mahajan, Nikhilesh Chawla
Topics & Concepts
MicrostructureSolderingElectromigrationIntermetallicMaterials scienceMetallurgyTransmission electron microscopyGrain sizeGrain boundaryComposite materialNanotechnologyAlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloy Microstructure Properties