Influence of laser texturing on interfacial bonding strength of W/Cu joint by spark plasma sintering
Haojie Zhang, Xue-qin Tian, Xiaoyu Ding, Hui-Yun Zheng, Laima Luo, Yucheng Wu, Jianhua Yao
Topics & Concepts
Materials scienceSpark plasma sinteringTungstenMicrostructureThermal shockComposite materialCopperThermal conductivityShear strength (soil)SinteringMetallurgySoil scienceSoil waterEnvironmental scienceMetal and Thin Film MechanicsAdvanced materials and compositesAdhesion, Friction, and Surface Interactions