Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach
Kai Hollstein, Xinyi Yang, K. Weide-Zaage
Topics & Concepts
Quad Flat No-leads packageHeat sinkSolderingThermalElectronic packagingMechanical engineeringPrinted circuit boardMaterials scienceWork (physics)Electronic engineeringNuclear engineeringEngineeringElectrical engineeringComposite materialLayer (electronics)ThermodynamicsPhysicsAdhesiveElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectromagnetic Compatibility and Noise Suppression