Low-dislocation-density ultrafine lamellar structure buffering triples ductility in Cu-8wt.%Sn alloy treated by rotary swaging and appropriate annealing
Lun Zhao, Liangguo Chen, Boyi Luo, Yuanxin Liang, Junqi Shi, Shunran Zhang, Zhongze Lin, Peijian Shi, Tianxiang Zheng, Bangfei Zhou, Yifeng Guo, Qiang Li, Chunmei Liu, Zhe Shen, Biao Ding, Yunbo Zhong
Topics & Concepts
Materials scienceLamellar structureBrittlenessDuctility (Earth science)Annealing (glass)Ultimate tensile strengthDislocationAlloyMetallurgyComposite materialCreepAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesAluminum Alloy Microstructure Properties