Hot‐Lithography SLA‐3D Printing of Epoxy Resin
Corrado Dall'Argine, Alexander Hochwallner, Nicolas Klikovits, Robert Liska, Jürgen Stampf, Marco Sangermano
Abstract
Abstract The hot‐lithography stereolithography 3D printing technology is used to print epoxy resins with high reactivity in order to achieve 3D printed structures. Different hydroxyl containing compounds are investigated as chain transfer agents and the viscoelastic properties of UV‐cured materials are fully characterized. The most promising formulations are studied at a high temperature, the 3D printing process parameters are defined and the printed object is fully characterized. By combining the suitable precursor materials in the photocurable formulation with the advanced hot‐lithography process, it is possible to produce 3D printed structures that are characterized by outstanding thermomechanical properties and good printability precision.