Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Yan Wen Tsau, Joke De Messemaeker, Abdellah Salahouelhadj, Mario González, Liesbeth Witters, Boyao Zhang, Marc Seefeldt, Eric Beyne, Ingrid De Wolf
Topics & Concepts
WaferMaterials scienceChemical-mechanical planarizationAnnealing (glass)Anodic bondingPolishingComposite materialCreepWafer bondingFinite element methodMechanism (biology)OptoelectronicsStructural engineeringEngineeringPhilosophyEpistemology3D IC and TSV technologiesAdvanced Surface Polishing TechniquesAdvanced ceramic materials synthesis