Device Integration Technology for Practical Flexible Electronics Systems
Masahito Takakuwa, Kento Yamagishi, Sunghoon Lee, Yusaku Tagawa, Takao Someya, Tomoyuki Yokota
Abstract
Abstract Flexible electronics are poised to serve as critical components in next‐generation wearable devices for telemedicine systems and metaverse applications, leveraging their unique ability to conform to dynamic body movements and irregular skin topography. To enable the development and optimization of practical wearable systems, the establishment of robust, flexible interconnect technologies that maintain the intrinsic flexibility of individual components remains required. However, conventional integration approaches employed in rigid electronics, such as metal soldering and plastic connectors, introduce fundamental limitations, including localized mechanical stress, thermal degradation during processing, and severe flexibility reduction at interconnection sites. These critical drawbacks necessitate the development of novel connection methodologies for flexible electronic device systems. This review focuses on the wiring and bonding technologies necessary for the industrial production of wearable devices using flexible electronics. By analyzing recent technological breakthroughs in material science and device integration, we further outline key challenges and development requirements for next‐generation interconnect technologies capable of addressing these multifaceted engineering constraints.