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Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation

Jia-wan Peng, Fenglin Zhang, Yumei Zhou, Ling-kang Xiong, Yao-jie Huang, Hongqun Tang

2023Chemical Engineering Journal32 citationsDOI

Topics & Concepts

DiamondMaterials scienceThermal conductivityComposite materialComposite numberBrazingThermal expansionHeat spreaderParticle (ecology)Heat transferThermodynamicsPhysicsGeologyOceanographyAlloyThermal properties of materialsAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesis
Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation | Litcius