Development of high performance 2.5D packaging using glass interposer with through glass vias

Jin Zhao, Zuohuan Chen, Fei Qin, Daquan Yu

2023Journal of Materials Science Materials in Electronics13 citationsDOI

Topics & Concepts

InterposerWaferReliability (semiconductor)Materials scienceElectronic packagingThrough-silicon viaTemperature cyclingSystem in packageDie (integrated circuit)Electronic engineeringMechanical engineeringComputer scienceEngineeringComposite materialOptoelectronicsElectrical engineeringEtching (microfabrication)ThermalPower (physics)NanotechnologyPhysicsMeteorologyQuantum mechanicsLayer (electronics)Chip3D IC and TSV technologiesSemiconductor Lasers and Optical DevicesElectronic Packaging and Soldering Technologies