Investigation on the thermal and hydrodynamic performances of a micro-pin fin array heat sink for cooling a multi-chip printed circuit board
Zuyuan Wang, Shichen Zheng, Shanglong Xu, Yalong Dai
Topics & Concepts
Heat sinkFinMaterials scienceHeat transferPrinted circuit boardCoolantThermalThermal resistancePressure dropElectronics coolingMechanical engineeringMechanicsComposite materialEngineeringThermodynamicsElectrical engineeringPhysicsHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies