Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys
Yongle Huang, Luo Yifei, Fei Xiao, Liu Binli, Tang Xin
Topics & Concepts
SolderingDie (integrated circuit)Materials scienceFailure mode and effects analysisTemperature cyclingComposite materialCatastrophic failureStress (linguistics)Shear (geology)Shear strength (soil)Thermal fatigueThermalPhysicsNanotechnologyMeteorologyLinguisticsPhilosophySoil waterEnvironmental scienceSoil scienceSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering TechnologiesSilicon and Solar Cell Technologies