Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
Bassel Ayoub, S. Lhostis, S. Moreau, Jean‐Gabriel Mattei, Anna Mukhtarov, H. Frémont
Topics & Concepts
Diffusion barrierIonic bondingOxideAnnealing (glass)DiffusionMaterials scienceIonDielectricCopperLayer (electronics)Chemical physicsNanotechnologyChemistryComposite materialOptoelectronicsMetallurgyThermodynamicsPhysicsOrganic chemistry3D IC and TSV technologiesSemiconductor materials and devicesIntegrated Circuits and Semiconductor Failure Analysis