Litcius/Paper detail

The Future of Hardware Technologies for Computing: N3XT 3D MOSAIC, Illusion Scaleup, Co-Design

Robert M. Radway, Khushal Sethi, W.-C. Chen, Jimin Kwon, Sheng-Wel Liu, T.F. Wu, E. Beigne, Max M. Shulaker, H.‐S. Philip Wong, Sugata Mitra

20212021 IEEE International Electron Devices Meeting (IEDM)21 citationsDOI

Abstract

The next leap in computing performance requires the next leap in integration. Just as integrated circuits brought together discrete components, this next level of integration must seamlessly fuse disparate parts of a system - e.g., compute, memory, inter-chip connections - synergistically for large energy and execution time benefits. We present this vision, its challenges, and discuss recent advances at the technology, architecture, and system levels.

Topics & Concepts

Computer scienceFuse (electrical)Computer architectureEmbedded systemArchitectureComputer hardwareEngineeringElectrical engineeringArtVisual artsAdvanced Memory and Neural ComputingCCD and CMOS Imaging SensorsParallel Computing and Optimization Techniques