Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution
J.H. Huang, Po‐Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yun Chen, Tsao‐Cheng Huang, Chin-Li Kao, Yung‐Sheng Lin, Y. C. Hung, C. R. Kao
Topics & Concepts
CopperCopper platingPlating (geology)MetalDecompositionChemistryInorganic chemistryTaguchi methodsMaterials scienceMetallurgyElectroplatingComposite materialOrganic chemistryLayer (electronics)GeologyGeophysicsElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionMolecular Junctions and Nanostructures