Measurement of interfacial bonding strength between the micro-spherical filler and the matrix in microcapsule/epoxy composites
Guijing Dou, Lei Zhao, Weihai Xia, Hanyang Jiang, Zhongyu Piao, Guangjian Peng
Topics & Concepts
Materials scienceComposite materialEpoxyFiller (materials)Matrix (chemical analysis)Epoxy Resin Curing ProcessesFiber-reinforced polymer compositesPolymer Nanocomposites and Properties