Spatial Atomic Layer Deposition for Energy and Electronic Devices
Robert L. Z. Hoye, David Muñoz‐Rojas, Zhuotong Sun, Hayri Okcu, Hatameh Asgarimoghaddam, Judith L. MacManus‐Driscoll, Kevin P. Musselman
Abstract
Functional thin films play a critical role in efforts toward efficient devices for energy conversion and storage, as well as low-loss electronics. These films need to be manufactured at scale, cost-effectively, and with precision. Atmospheric pressure spatial atomic layer deposition (AP-SALD) has emerged as a promising technique for fulfilling these requirements. AP-SALD replicates the subnanometer control of thickness, uniformity, crystallinity, and conformality to the substrate featured in conventional atomic-layer-deposited films, but has the important advantage of depositing these films with growth rates that are orders of magnitude higher. This review discusses the opportunities and advantages that AP-SALD opens up in energy-conversion and storage devices, as well as low-loss electronics. In particular, the review features recent work on using AP-SALD-grown films for photovoltaics, light-emitting diodes, self-powered sensors, and photoelectrochemical cells and batteries, as well as in transparent conductive materials and the epitaxial growth of thin films. Perspectives on future unexplored opportunities for AP-SALD in energy and low-loss electronics are also discussed.